KIFFE ENGINEERING GmbH
Am Krebsgraben 18
D | 78048 VS-Villingen
+49 7721 / 8003 0
Polishing, polish grinding and polish lapping are some of the most demanding techniques in surface processing. With polish lapping, satin or mirror polished surfaces with very low roughness can be achieved. This procedure is ideal for precision machining of different materials.
Compared to conventional polishing with a soft cloth and polishing paste, polish lapping has the advantage of further improving the micro geometry of the functional area.
The flatness in the peripheral areas is also maintained.
During the polish lapping, the functional surfaces are polished by a very low removal and filling of the valleys of the roughness profile. Polish lapping can also increase corrosion resistance of workpieces.
The fundamental difference between polish lapping and polish grinding is the binding of the polishing abrasive. In lapping, the polishing abrasive is unbound in a paste or a carrier liquid (oil, petroleum, water) while when grinding, the abrasive is bound in a grinding wheel. The polishing abrasive used is usually an aluminum oxide or diamond grit in particle sizes between 15µm and 0.3Μm. Both procedures are material removal manufacturing processes.
With the use of special polishing additives almost all materials can be polish lapped, polish ground or polished:
Thanks to our highly modern machines and optimum process design, we can offer you the best quality during the polishing process.